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EAMIBOND EPNS

Non Sag, Solvent Free, Epoxy Resin Bonding Agent

PRODUCT DESCRIPTION

EAMIBOND EPNS is solvent free, thixotropic, moisture in sensitive, non-sag bonding agent, based on high strength epoxy resin and selected curing agents for bonding solid surfaces.

PRODUCT DOCUMENTS

Technical Data Sheet

TYPICAL APPLICATIONS

EAMIBOND EPNS is high modulus, with thixotropic consistency, bonding agent for both horizontal, vertical & over head surfaces.
EAMIBOND EPNS provides a permanent bond greater than the tensile strength of the concrete substrate.

It is suitable for many applications
such as:

  • Bonding sectional concrete bridges providing a water-resistant joint.

  • Blow hole filling on concrete surface.

  • Thin film bonding and concrete repair.

  • As structural bonding agent for precast concrete.

  • Crack and surface sealing.

  • General bonding & leveling compound for concrete, mortar, stones, renders, ceramics, steel, aluminum, wood chip boards, polyester.

  • Bonding carbon fibers to concrete surfaces.

  • Bond any two solid surface.

PRODUCT FEATURES

  • Easy to mix and to apply.

  • Solvent-free, meets VOC (Volatile Organic Content) standards.

  • 100 % solids and non-shrink.

  • Impact resistance.

  • Excellent mechanical properties.

  • High abrasion resistance.

  • Excellent adhesion to concrete and other surfaces.

  • Moisture insensitive, bonds well to dry and damp surfaces.

  • Cures to a waterproof state.                                            The cured film is impermeable to water.

  • Non-sag at even high temperatures.

  • Resistant to chemical attack.

  • Used in both horizontal and vertical surfaces.

  • Formulated to be suitable for the Middle East Climate.

STANDARDS

  • EAMIBOND EPNS complies with the requirements of ASTM C 881 Type V Grade 3 Class B and C.

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